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常见例句
- This paper describes the development of phase shifting lithography and its applications in ULSI technology.
本文综述了相移光刻技术的发展及其在ULSI中的应用。 - Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介绍了ULSI多层铜互连线中的碟形坑问题,对其产生的原因及影响因素进行了分析。 - In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.
本论文主要研究了ULSI中铜互连线的微观结构和应力及其对与电徙动MTF的影响。 返回 ulsi